[Features]
· The convex part of the embossing comes into direct contact with the adherend, providing very high conductivity in the thickness direction.
· The adhesion area covers a large area of the conductive part, which ensures stable conductivity.
· Excellent corrosion resistance.
· May be soldered.
[Applications]
· For enhancement of electromagnetic wave shielding and grounding.
· For grounding of PC units and flat cables.
· For power collection by solar cells.